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Wire Bonder

Introduction

The Eagle AERO is the pioneer product to be imbued with the now patented X-Power, thermosonic bonding technology in the wire bonding process, supported by the Aeroducer transducer that supports a dual frequency of X and Y direction. Built with great management software like AeroEye for smarter monitoring and quality assurance.

Characteristics

Device Name	Wire Bonder
Model	ASM Eagle-Areo
Characteristics	-Overall Dimension: W: 990mm D: 1760mm H: 1200mm -Weight: 800Kg -Voltage: 100V ~ 240V -Frequency: 50Hz ~ 60Hz -Power Consumption: 1500W -Compressed Air: Minimum 5 BAR, 150 LPM, Inlet Tube O.D. 12mm -Program Management: Remote Upload/Download, Bonding Parameter Checking -Host communication via SECS/GEM Protocol: Host communication via HSMS, SEGS/GEM, compatible Bonding program management, data upload, Bonding parameter check and wire layout check. -Bonding method: Thermal ultrasound with X Power -Wire Size: 0.5 ~ 2.0mil -Wire Length: 0.2 - 8mm -Bonding Speed: 24 wires/minute for 2mm -Bonding Accuracy: 2.0µm @ 3 sigma -Soldering Area: 56mm x 90mm (Leadframe Width <=100mm) -PR accuracy: 0.3 µm (high mag) -Lead wire positioner probing: 2 ms per lead wire -Line radian control: Fully programmable -Number of Bonding lines: up to 10000 for Step Repeat Matrix -Program storage 30,000 hard disk programs -Suitable Box L: 140 - 305mm H: 180mm (max) W: 32 - 115mm -Suitable Lead Frame L: 140 - 300mm T: 0.1 - 0.8mm W: 28 - 105mm -Box Pitch: 2.4 - 10mm Programmable -Number of buffer cassettes: 2 - 3

Device Name

Wire Bonder

Model

ASM Eagle-Areo

Characteristics

-Overall Dimension: W: 990mm D: 1760mm H: 1200mm

-Weight: 800Kg

-Voltage: 100V ~ 240V

-Frequency: 50Hz ~ 60Hz

-Power Consumption: 1500W

-Compressed Air: Minimum 5 BAR, 150 LPM, Inlet Tube O.D. 12mm

-Program Management: Remote Upload/Download, Bonding Parameter Checking

-Host communication via SECS/GEM Protocol: Host communication via HSMS, SEGS/GEM, compatible Bonding program management, data upload, Bonding parameter check and wire layout check.

-Bonding method: Thermal ultrasound with X Power

-Wire Size: 0.5 ~ 2.0mil

-Wire Length: 0.2 - 8mm

-Bonding Speed: 24 wires/minute for 2mm

-Bonding Accuracy: 2.0µm @ 3 sigma

-Soldering Area: 56mm x 90mm (Leadframe Width <=100mm)

-PR accuracy: 0.3 µm (high mag)

-Lead wire positioner probing: 2 ms per lead wire

-Line radian control: Fully programmable

-Number of Bonding lines: up to 10000 for Step Repeat Matrix

-Program storage 30,000 hard disk programs

-Suitable Box L: 140 - 305mm H: 180mm (max) W: 32 - 115mm

-Suitable Lead Frame L: 140 - 300mm T: 0.1 - 0.8mm W: 28 - 105mm

-Box Pitch: 2.4 - 10mm Programmable

-Number of buffer cassettes: 2 - 3